"High Density Interconnect (HDI) printed circuits are now being designed in ever-increasing quantities for very high speed applications. The challenge of opto-electronics and integration of photonics into the printed circuit has started to take off. In the next seven years, expectations are that photonic PCBs will grow to a $2.5 billion industry.
This paper looks at the issues, materials and current processes being researched to create this integrated Opto-Electronic Circuit Board by European, Japanese and North American organizations. In addition to reviewing the global players in polymer photonics, this paper will review the current programs of four of the six groups globally:
* EOBC-OptoFoil (Univ. of Ulm, Fraunhafer Inst, Daimler-Chrysler, Siemens)
* Truemode (Terahertz)
* PolyGuide (Dupont, HP)
* OptoBump (NTT)
* TOPCat (NIST, 3M, Goodyear)
* JIEP"
PCB Design Collaboration White Paper
THE DEVELOPING TECHNOLOGIES OF
INTEGRATED OPTICAL WAVEGUIDES
IN PRINTED CIRCUITSDDeecceemmbbeerr ,, 22000088
ABSTRACTHigh Density Interconnect (HDI) printed circuits are now being designed in ever-increasing quantities for very high speed applications. The challenge of opto-electronics and integration of photonics into the printed circuit has started to take off. In the next seven years, expectations are that photonic PCBs will grow to a $2.5 billion industry. This paper looks at the issues, materials and current processes being researched to create this integrated Opto-Electronic Circuit Board by European, Japanese and North American organizations. In addition to reviewing the global players in polymer photonics, this paper will review the current programs of four of the six groups globally:
. EOBC-OptoFoil (Univ. of Ulm, Fraunhafer Inst, Daimler-Chrysler, Siemens) . Truemode. (Terahertz) . PolyGuide (Dupont, HP) . OptoBump (NTT) . TOPCat (NIST, 3M, Goodyear) . JIEP
AUTHOR: Happy HoldenMentor Graphics Corporation1811 Pike RoadLongmont, CO 80501 USA Phone: +1 800-592-2210 or +1 503-685-7000 happy_holden@mentor.com
www.mentor.com/pcbThe Developing Technologies of Integrated Optical Waveguides in Printed Circuits Happy Holden, Mentor Graphics, Longmont, CO USA Email: happy_holden@mentorcom ABSTRACT High Density Interconnect (HDI) printed circuits are now being designed in ever-increasing quantities for very high speed applications. The challenge of opto-electronics and integration of photonics into the printed circuit has started to take off. In the next seven years, expectations are that photonic PCBs will grow to a $2.5 billion industry. This paper looks at the issues, materials and current processes being researched to create this integrated Opto-Electronic Circuit Board by European, Japanese and North American organizations. In addition to reviewing the global players in polymer photonics, this paper will review the current programs of four of the six groups globally: . EOBC-OptoFoil (Univ. of Ulm, Fraunhafer Inst, Daimler-Chrysler, Siemens) . TruemodeT (Terahertz) . PolyGuide (Dupont, HP) . OptoBump (NTT) . TOPCat (NIST, 3M, Goodyear) . JIEP INTRODUCTION (HDIS) as a term to refer to all of these various microvia The widespread use of new electronic components technologies. employing Ball-Grid Array (BGA), Chip Scale Packaging (CSP) and other evolving technology form-factors means WHY USE MICROVIAS IN PCBs new fabrication techniques must be used to create printed Better Electrical Performance/Signal Integrity circuit boards (PCBs) that will accommodate parts with Due to the physical structure of microvias, there is a extremely tight lead pitches and small geometries. In reduction in switching noise. This is attributable to the addition, extremely fast clock speeds and signal bandwidths decreased inductance and capacitance of the via as its challenge systems designers to find better ways of physical size becomes smaller and shorter. A microvia will overcoming the negative effects that radio frequency have nearly one-tenth the electrical parasitics of a through-interference (RFI) and electro-magnetic interference (EMI) hole. Another advantage of using microvia technology for have on their product's performance. Opto-electronics creating interconnects is a reduction in signal reflections and printed circuits are based on HDI-Microvia technology. In crosstalk between traces. The corresponding increase in addition to the extremely high-frequency electrical signals, routability area also allows designers to place traces further the need now includes the requirement for integrated-optical apart when necessary to reduce crosstalk. waveguides. Finally, increasingly restrictive cost targets are compounding problems associated with today's smaller, Improved RFI/EMI/ESD denser, lighter and faster systems. When working with opto- In the realm of RFI/EMI, increased routability area electronics, the need for the integrated waveguides is a combined with the microvias physical via-in-pad major... [download for more]
